| 1969 |
AOI ELECTRONICS CO., LTD. established with Capital of \40,000,000.
Commenced production of Fixed Carbon Film Resistors. |
| 1972 |
Commenced production of Hybrid Integrated Circuits(HIC)And Transistors. |
| 1973 |
Established Kanonji Plant.
Commenced production of Monolithic ICs.
Commenced production of Diodes.
Commenced production of LEDs. |
| 1975 |
Commenced production of Resistor Networks. |
| 1976 |
Commenced production of Chip Resistors.
Commenced Plating of Chip Resistors. |
| 1977 |
Capital increased to \130,000,000.
Commenced production of Thermal Print Heads. |
| 1982 |
Commenced production of Zener Diodes and Leadless Diodes. |
| 1983 |
Commenced Plating of ICs. |
| 1984 |
Capital increased to \260,000,000. |
| 1989 |
Tokyo Sales Office set up in Minami-Aoyama. |
| 1990 |
Commenced production of Chip on Boards. |
| 1991 |
Commenced production of Card Modules.
Commenced production of Sensors. |
| 1992 |
Commenced production of IC Package for Crystal Device.
Commenced production of LEDs' Heads. |
| 1993 |
Commenced production of R.C. Chips. |
| 1994 |
Commenced production of Chip Networks.
Certificate of Registration of ISO9002 at Takamatsu Factory. |
| 1995 |
Commenced production of C-R Networks. |
| 1996 |
Completed development for Flip Chip Mount Technology. |
| 1997 |
Capital increased to \466,250,000.
Completed newly construction of Head Office and Takamatsu plant.
Extension of Kanonji Plant.
Tokyo Sales Office moved to "Wold Trading Center Building"at Hamamatsucho.
Completed development for Chip Size Package Technology.
Completed development for leadless IC Package. |
| 1998 |
Capital increased to \1,557,750,000.
Commenced production of Optical Sensors. |
| 1999 |
Completed development and commenced production of TPH with High integrated IC chip.
Completed development and commenced production of High precision Resistor-Network.
Certificate of Registration of ISO9001 at Kanonji Factory. |
| 2000 |
Listed on the Second Section of Tokyo Stock Exchange.
Capital increased to \4,545,500,000.
Certificate of Registration of ISO 14001at Head office繝ｻTakamatsu Plant. |
| 2001 |
The head office and the completion of the Takamatsu factory extension.
Certificate of Registration of ISO 14001at Kanonji Factory. |
| 2002 |
An ISO 9001 quality system examination registration certificate is shifted to 2000 editions.(the Kanonji production headquarters). |
| 2003 |
Completed development and commenced production of High Pixel density TPH.
Technical collaboration agreement with Mitsubishi Chemical Corporation
lithium polymer battery.
Certificate of Registration of ISO9001:2000,with the transition from ISO9002:1994,at Takamatsu Plant.
Completed development for Micro Metal Tool and Nano-Tweezers(MEMS).
Completed development for Camera Modules. |
| 2004 |
Commenced production of High-precision & High-density Chip Resistor Networks.
Completed development and commenced production of TPH operation by battery for mobile devices application.
Completed development for Ultra Thin PL package. |
| 2005 |
An ISO 14001 Enviroment system examination registration certificate is shifted to 2004 editions.(the Kanonji Factory)
Completed development for Large footprint and Thin type lithium polymer battery
Completed development and commenced production of High-density,high power
and low-resistance Resistors.
Completed development of anti-impact Resistance Heater. |
| 2006 |
Completed development of multi-chip stacked package.
Completed development of Power Package.
Completed development of low voltage drive TPH for mobile printer.
Completed development of PL package with Cupper.
Completed development and commenced production of Erase Head. |
| 2007 |
Completed rebuilding of Kanonji Plant.
Completed development of PL package with Chip on Lead structure.
Completed development of package with coating open sensor for Blu-ray DVD.
Completed development of Ultra thin(0.3mm)IC package.
Completed development of Nano Tweezers with contact detection. |
| 2008 |
Completed development of stacked PL package.
Completed development of multi-flip Chip package.
Completed development of high-power Attenuator. |
| 2009 |
Completed development of inclined IC package for gyroscope.
Completed development of miniature(0.8-mm-square) PL package.
Completed development of acceleration sensor.
Completed development of PL package for diode.
Completed development of high performance battery for humanoidrobot. |
| 2010 |
Completed development of highly durable TPH.
Completed development of flip Chip PL package.
Completed development of large scale battery system for solar panel.
Completed newly Extension of Takamatsu Plant. |
| 2011 |
Completed development of IR(Infrared radiation) sensor with PL package.
Completed development of package with GOC(Glass On Chip) structure for opto elctronics IC.
Completed development of package with wide cavity type sensor for Blu-ray DVD.
Completed development of PL package for MEMS shock sensor.
Completed development of PL package(0.6x0.3mm) for TVS (transient voltage suppression) diode. |
| 2012 |
Completed development of a cavity type PL package for opto elctronics IC.
Completed development of package for proximity sensor.
Completed development of IR sensor package for motion sensor.
Completed development of blood flow sensor package for medical application.
Completed development of technology for POP(Package On Package).
Commenced production sercice with BG(Back Grinding) and DC(Dicing) process for GaAs(Gallium Arsenide.)
Completed development of package for current sensor. |
| 2013 |
Acquired HIGH COMPONENTS AOMORI CO.,LTD as subsidiary compant.
Completed development of package for magnetic sensor.
Completed development of a cavity type package for medical application.
Completed development of TPH for high efficiency printing and high durability.
|
| 2014 |
Completed development of (a hollow type) package for pressure sensor.
Completed development of a cavity type PL package for (UV(Ultraviolet),pressure)sensor.
Completed development of TPH for low electric current consumption.
|
| 2015 |
Completed technology development of visible two-dimensional Fourier spectroscopy unit(Two-dimensional hyperspectral camera).
Completed technology development of near IR Fourier spectrocopy unit(Two-dimensional hyperspectral camera).
Completed development of IGBT module.
Completed development of cavity type package for gas sensor.
Completed development of shield package.
Completed development of package for pen pressure sensor.
Completed development of the high heat radiation wiring board. |
| 2016 |
Acquired OUME ELECTRONICS CO.,LTD as subsidiary compant.
Completed development of flip-chip package for low on-resistance.
Completed technology development of far IR Fourier spectroscopy unit(Two-dimensional hyperspectral camera).
Certificate of Registration ISO/TS16949 at Takamatsu
Plant.
|
| 2017 |
Completed development of Wettable flank structure
package.
Completed development of 5-side wall
package.
Completed development of miniature （0.4㎜×0.2㎜） PL
package for TVS.
Completed development of watertight
absolute pressure sensor.
|
| 2018 |
Completed development of Fan-out WLP type package
（FOLP）.
Completed development of hollow package for
image sensor.
Completed development of cavity package
for reflective rotary encoder.
Completed development
of thin / thick film fusion TPH.
Completed development
of Low voltage drive – high chromogenic TPH.
Commenced
production of insulating heat dissipation ceramic
substrate.
Certification of Registration
IATF16949：2016 at Takamatsu Plant.
|
| 2019 |
Established Asahimachi Plant.
Commenced sample
build of FOLP package for 5G.
Completed development
of the Direct power package.
Commenced production of
optical communication module.
|
| 2020 |
Tokyo Sales Office relocated to "Shinagawa Grand
Central Tower. |
| 2022 |
Transition to the Standard Market of Tokyo Stock
Exchange. |
