New arrival technical information

Introduction of in-house developed technical information.

FOLP Technology®

Structure

Cross Section
Outer view

ROADMAP

FOLP FEATURES

One stop solution : AOI-ELECTRONICS Group.

Short cycle time:Horizontal specialization Process

  • *Wafer Bumping /OUME-ELECTRONICS
  • *Substrate(RDL) Process/AOI-ELECTRONICS ASAHIMACHI PLANT
  • *Assembly +TEST/T＆R Process/AOI-ELECTRONICS TAKAMATSU PLANT

Short cycle time

AOI use the Low Dk/Df substrate materials for RF 5G devices.

High Yield

KGD +KG Substrate Combination

High reliability

  • modified Epoxy resin
  • Solder materials of various composition attach

Low Cost

  • No use PI system
  • In a batch-molding method without Cu-pillar capillary underfil
  • Adopting the mechanical de-bonding system