EM Noise Shielding Package
Shield package structure drawing
Features
Downsizing
To allow downsizing compared to conventional metal plate shielding, since there is no need to put mounting padfor metal case connecting.
Low-profile
To provide low-profile package by using thinner electroforming substrate (acceptable from Typ 0.30mm).
Noise Reduction
To realize higher EMI shield effect by forming shield metal film on the upper surface and four sides of package.
Design Flexibility
To allow flexible package design because of independent terminal array pattern forming.
Application
- Smartphones, Cellular phones, Tablet Terminals, Wearable Products
- PC, DSC, Game Consoles, Household Appliances, Health Care Products
- Satellite Communication Equipments, Radio Devices(Radar, Aerials, etc.)
