2025.02.06 Participation in the Selected Project for “Technology Development for Automation of Post-Processing, Including Advanced Packaging” under the NEDO Public Offering
2024.07.09 Regarding the Construction of the Production Line for Advanced Semiconductor Panel Packages at Sharp Mie Plant 79KB（81.47 KB）
2024.03.09 AOI technical article about power module packaging to publish on IMAPS Advancing Microelectronics Magazine 2024 Volume 51
2023.10.25 AOI will attend the exhibition APCS2023 / SEMICON JAPAN at TOKYO BIG SIGHT on 13-15 December 2023.
2023.03.13 19th iMAPS：International Microelectronics Assembly ＆ Packaging Society.March 13-16,2023 Arizona Fountain Hills,We-Ko-Pa Resert ＆Conference Center.
2023.03.13 APEC2023：Applied Power Electronics Conference 2023.March 19-23,2023 Florida Orlando, Orange Country Convention Center
